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The epitaxial growth and structure of metal overlayers on oriented substrates studied by surface x-ray diffraction.

机译:通过表面X射线衍射研究了定向衬底上金属覆盖层的外延生长和结构。

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摘要

The growth mode and structure of metal overlayers, stabilised by molecular beam epitaxy, on oriented semiconductor and metal substrates, was investigated using surface x-ray diffraction and synchrotron radiation. The growth of the metastable fee phase of Fe on Cu(001) at 300 K followed a layer- by-layer mode with limited atomic intermixing of Fe and Cu at the overlayer-substrate interface. Relaxation to the bulk bcc Fe structure occurred at a critical coverage dependent on the growth conditions. Fe deposition at higher substrate temperatures was characterised by strong Fe-Cu intermixing giving poor layer development. The growth was diffusion limited at low temperature. The vertical morphology of clean Cu(00l) and adsorbate-covered surfaces at specific Fe coverages was determined from kinematical analysis of intensity measurements perpendicular to the surface and showed changes in the surface interlayer spacing with film thickness. The metastable bcc phase of Co grown on GaAs(001) evolved in a predominantly three-dimensional manner with significant disruption of the semiconductor substrate, causing inclusion of As and Ga into the growing metal film. The structure of the Co film, determined from x-ray specular reflectivity measurements, was consistent with bcc Co. The behaviour of Fe deposited on GaAs(001) was similar, although the overlayer formation was better ordered. In deposited on the Si(001)2x1 surface at substrate temperatures between 300 to 623 K exhibited a Stranski-Krastanov growth mode, that is the formation of one or two atomic monolayers (ML), followed by three-dimensional island formation. The metal induced a series of coverage and temperature dependent surface reconstructions. Deposition of In at 300 K caused only minimal substrate disruption, whereas In and Ga interacted strongly with the dimerised Si(001)2x1 surface at a substrate temperature of 373 K. During formation of the Si(001)2x1-In surface reconstruction the dimerised Si structure was partly destroyed and replaced by In dimers.
机译:使用表面X射线衍射和同步加速器辐射研究了通过分子束外延在定向的半导体和金属基板上稳定的金属覆盖层的生长模式和结构。 Fe在300 K的Cu(001)上的亚稳电荷相的生长遵循层-层模式,Fe和Cu在上层-基底界面处的原子混合有限。取决于生长条件,在临界覆盖率下会发生块状bcc Fe结构的弛豫。在较高的衬底温度下,Fe的沉积特征是强固的Fe-Cu混合,从而导致不良的层发展。生长在低温下受到扩散限制。通过垂直于表面的强度测量的运动学分析,确定了在特定的Fe覆盖率下,干净的Cu(00l)和被吸附物覆盖的表面的垂直形态,并显示了表面夹层间距随膜厚的变化。在GaAs(001)上生长的Co的亚稳态bcc相主要以三维方式演化,半导体衬底受到明显破坏,导致As和Ga包含在生长的金属膜中。由x射线镜面反射率测量确定的Co膜的结构与bcc Co一致。尽管覆盖层的形成有序,但沉积在GaAs(001)上的Fe的行为相似。在300-623 K之间的衬底温度下沉积在Si(001)2x1表面上时,表现出Stranski-Krastanov生长模式,即形成一个或两个原子单层(ML),然后形成三维岛。这种金属引发了一系列覆盖率和温度相关的表面重建。 In在300 K的沉积仅引起最小的衬底破坏,而In和Ga在373 K的衬底温度下与二聚的Si(001)2x1表面发生强烈相互作用。在形成Si(001)2x1-In表面重建期间,二聚化Si结构被部分破坏并被In二聚体取代。

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  • 作者

    James, Mark Andrew.;

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  • 年度 1995
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  • 原文格式 PDF
  • 正文语种 {"code":"en","name":"English","id":9}
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